EFR32BG27 Common Specs
Low Power Wireless System-on-Chip
- High Performance 32-bit 76.8 MHz ARM Cortex®-M33 with DSP instruction and floating-point unit for efficient signal processing
- Up to 768 kB flash program memory
- Up to 64 kB RAM data memory
- 2.4 GHz radio operation
Radio Performance
- 106.9 dBm sensitivity @ 125 kbps GFSK
- -99.2 dBm sensitivity @ 1 Mbit/s GFSK
- -96.3 dBm sensitivity @ 2 Mbit/s GFSK
- TX power up to 8 dBm
Low System Energy Consumption
- 3.6 mA RX current (1 Mbps GFSK)
- 4.1 mA TX current @ 0 dBm output power
- 9.2 mA TX current @ 6 dBm output power
- 11.3 mA TX current @ 8 dBm output power
- 29 μA/MHz in Active Mode (EM0) at 76.8 MHz
- 1.6 μA EM2 DeepSleep current (64 kB RAM retention and RTC running from LFRCO)
- 0.18 μA EM4 current
Wide Selection of MCU Peripherals
- 16-bit Analog to Digital Converter (IADC)
- Analog Comparator (ACMP)
- Up to 26 General Purpose I/O pins with output state retention and asynchronous interrupts
- 8 Channel DMA Controller
- 12 Channel Peripheral Reflex System (PRS)
- 3 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels
- 2 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels
- 32-bit Real Time Counter
- 24-bit Low Energy Timer for waveform generation
- 1 × Watchdog Timer
- 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
- 1 × Enhanced Universal Asynchronous Receiver/Transmitter (EUART)
- 2 × I2C interface with SMBus support
- Digital microphone interface (PDM)
- Precision Low-Frequency RC Oscillator to replace 32 kHz sleep crystal
- RFSENSE with selective OOK mode
- Die temperature sensor with +/- 1.5 °C accuracy after single-point calibration
- Coulomb counter integrated into DC-DC
Supported Modulation Format
- (G)FSK with fully configurable shaping
- OQPSK DSSS
- (G)MSK
Protocol Support
- Bluetooth Low Energy (Bluetooth 5.4)
- Bluetooth mesh
- Proprietary
Wide Operation Range
- 1.8 V to 3.8 V single power supply for devices with Buck DC-DC
- 0.8 V to 1.7 V single power supply for devices with Boost DC-DC
- -40 °C to 125 °C
Packages
- QFN40 5 mm × 5 mm × 0.85 mm
- QFN32 4 mm × 4 mm × 0.85 mm
- WLCSP39 2.291 mm x 2.624 mm x 0.5 mm
BG27 Security Features
- Hardware Cryptographic Acceleration for AES128/192/256, ChaCha20-Poly1305, SHA-1, SHA-2/256/384/512, ECDSA+ECDH(P-192, P-256, P-384, P-521), Ed25519 and Curve25519, J-PAKE, PBKDF2
- True Random Number Generator (TRNG)
- ARM® TrustZone®
- Secure Boot (Root of Trust Secure Loader)
- Secure Debug Unlock
- DPA Countermeasures
- Customer Key Management with PUF
- E-Tamper
- Secure Attestation
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