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BGM13S22F512GA

Ultra-Small System-In-Package for Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA), and Bluetooth Mesh Connectivity

The BGM13S22F512GA is a SIP module for Bluetooth 5 LE and Bluetooth mesh connectivity built around the EFR32BG13 Series 1 SoC. It delivers robust RF performance, low energy consumption, regulatory compliance certifications, a wide selection of MCU peripherals, and a simplified development experience, all in a small 6.5 × 6.5 × 1.4 package. Minimizing the engineering efforts and development costs associated with adding Bluetooth connectivity to any design, the BGM13S22F512GA helps accelerate the time-to-market of products for end applications like wearables, IoT end-node devices and gateways, sports and wellness, home and building automation, beacons, industrial automation, and others.
BGM13S22F512GA
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